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General Micro Electronics Incorporated: Semiconductor Assembly Process Case Solution & Answer

General Micro Electronics (GME) is designed, assembled and semiconductors for wireless, memory management, cable trunking and test network applications. In January, he bought a new thread glue machine for its assembly operations support contract culture. For the first couple of months, the success of the new machine, but its performance has become more erratic and was eventually reached to the innermost strength of the wireless connection level. The intensity of the cable connection is an important dimension of quality of the semiconductor chips. With the use of overtime in the existing wire bonding equipment is very close to full utilization, the need to improve the performance of the new wire bonding machine was critical. The GME operations personnel were constantly tweaking the new machine in order to find a combination of process parameters to improve the performance of the machine. Unfortunately, the machine performance continued to deteriorate.
by
Scott M. Shafer,
Charles Volk
Source: Case Research Association of North America (NACRA)
15 pages.
Release: May 1, 2013. Prod #: NA0217-PDF-ENG
General Micro Electronics, Incorporated: Case Resolution Process Semiconductor Assembly

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